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TC7135CPL Datasheet(PDF) 20 Page - Microchip Technology |
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TC7135CPL Datasheet(HTML) 20 Page - Microchip Technology |
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20 / 24 page ![]() TC7135 DS21460C-page 20 2004 Microchip Technology Inc. 64 Lead Metric Plastic Quad Flat (BU) (MQFP) D E1 e B c 2 n 1 A A1 A2 E D1 f a (F) b L § Significant Characteristic Drawing No. C04-022 Notes: Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC equivalent: MS-022 BE. *Controlling Parameter .063 REF (F) Footprint (Reference) Mold Draft Angle Top Mold Draft Angle Bottom Foot Angle Lead Width Lead Thickness b a c B f .004 0° Dimension Limits Overall Height Molded Package Thickness Molded Package Width Molded Package Length Foot Length Standoff § Overall Width Number of Pins Pitch A L E1 D1 A1 E A2 .029 .035 .551 BSC .551 BSC .000 .098 .677 BSC .106 MIN e n Units .031 BSC NOM 64 INCHES 1.60 REF .009 6° 0.11 0° 0.23 7° MILLIMETERS* 0.80 BSC 2.70 14.00 BSC 14.00 BSC 0.88 17.20 BSC .124 .041 .114 .010 0.73 0.00 2.50 MIN MAX NOM 3.15 1.03 0.25 2.90 MAX 64 5° 5° 16° 5° 16° 16° 5° 16° Overall Length D .677 BSC 17.20 BSC 0.45 0.29 .018 .011 Formerly TelCom PQFP package. 2.50 -- .098 -- -- -- -- -- -- -- -- -- -- -- -- -- |
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