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MCP2150 Datasheet(PDF) 41 Page - Microchip Technology |
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MCP2150 Datasheet(HTML) 41 Page - Microchip Technology |
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41 / 52 page ![]() 2002 Microchip Technology Inc. Preliminary DS21655B-page 41 MCP2150 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 18-Lead PDIP (300 mil) Example: 18-Lead SOIC (300 mil) Example: 20-Lead SSOP (209 mil, 5.30 mm) Example: XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX XXXXXYYWWNNN XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX XXXXXYYWWNNN XXXXXXXXXXX XXXXXXXXXXX XXXYYWWNNN Legend: XX...X Customer specific information* YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard device marking consists of Microchip part number, year code, week code and traceability code. MCP2150I/SS XXXXXXXXXXX XXXYYWWNNN MCP2150-I/SO XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX XXXXXYYWWNNN MCP2150-I/P XXXXXXXXXXXXXXXXX XXXXXYYWWNNN |
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