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DIM2400ESS12 Datasheet(PDF) 4 Page - Dynex Semiconductor |
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DIM2400ESS12 Datasheet(HTML) 4 Page - Dynex Semiconductor |
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4 / 9 page ![]() SEMICONDUCTOR DIM2400ESS12-A000 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures 4/9 www.dynexsemi.com ELECTRICAL CHARACTERISTICS Tcase = 25° C unless stated otherwise. Symbol Parameter Test Conditions Min. Typ. Max. Units Ices Collector cut-off current VGE = 0V, VCE = VCES - - 3 mA VGE = 0V, VCE = VCES, Tcase = 125° C - - 75 mA Ices Gate leakage current VGE = ±20V, VCE = 0V - - 12 µA VGE(TH) Gate threshold voltage IC = 80mA, VGE = VCE 4.5 5.5 6.5 V VCE(sat) Collector-emitter saturation voltage VGE = 15V, IC = 2400A - 2.2 2.8 V VGE = 15V, IC = 2400A, Tcase = 125° C - 2.6 3.3 V IF Diode forward current DC - 2400 A IFM Diode maximum forward current tp = 1ms - 4800 A VF Diode forward voltage IF = 2400A - 2.1 2.4 V IF = 2400A, Tcase = 125° C - 2.1 2.4 V Cies Input capacitance VCE = 25V, VGE = 0V, f = 1MHz 270 - nF LM Module inductance - - 10 - nH RINT Internal resistance - - 0.09 - m Ω SCData Short circuit. Isc Tj = 125° C,Vcc = 2500V, I1 - 16500 - A tp ≤ 10µs, VCE(max) = VCES - L*.di/dt I2 - 13500 - A IEC 60747-9 Note: Measured at the power busbars and not the auxiliary terminals *L is the circuit inductance + L M |
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