TDA8927ST datasheet(3/36 Pages) PHILIPS

3 / 36 page

2001 Dec 11

Philips Semiconductors

Objective speciﬁcation

Power stage 2

× 80 W class-D

audio ampliﬁer

TDA8927

FEATURES

• High efficiency (>94%)

• Operating voltage from ±15 to ±30 V

• Very low quiescent current

• High output power

• Short-circuit proof across the load, only in combination

with controller TDA8929T

• Diagnostic output

• Usable as a stereo Single-Ended (SE) amplifier or as a

mono amplifier in Bridge-Tied Load (BTL)

• Electrostatic discharge protection (pin to pin)

• Thermally protected, only in combination with controller

TDA8929T.

APPLICATIONS

• Television sets

• Home-sound sets

• Multimedia systems

• All mains fed audio systems

• Car audio (boosters).

GENERAL DESCRIPTION

The TDA8927 is the switching power stage of a two-chip

set for a high efficiency class-D audio power amplifier

system. The system is split into two chips:

• TDA8927J/ST/TH; a digital power stage in a DBS17P,

RDBS17P or HSOP24 power package

• TDA8929T; the analog controller chip in a SO24

package.

With this chip set a compact 2

× 80 W audio amplifier

system can be built, operating with high efficiency and very

low dissipation. No heatsink is required, or depending on

supply voltage and load, a very small one. The system

operates over a wide supply voltage range from

±15 up to ±30 V and consumes a very low quiescent

current.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

General; VP = ±25 V

supply voltage

±15

±25

±30

Iq(tot)

total quiescent current

no load connected

−

efﬁciency

Po =30W

−

Stereo single-ended conﬁguration

output power

RL =4 Ω; THD = 10%; VP = ±25 V

−

RL =4 Ω; THD = 10%; VP = ±27 V

−

Mono bridge-tied load conﬁguration

output power

RL =4 Ω; THD = 10%; VP = ±17 V

110

−

RL =8 Ω; THD = 10%; VP = ±25 V

120

150

−

TYPE NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

TDA8927J

DBS17P

plastic DIL-bent-SIL power package; 17 leads (lead length

12 mm)

SOT243-1

TDA8927ST

RDBS17P

plastic rectangular-DIL-bent-SIL power package; 17 leads (row

spacing 2.54 mm)

SOT577-1

TDA8927TH

HSOP24

plastic, heatsink small outline package; 24 leads; low stand-off

height

SOT566-2

TDA8927ST Datasheet(PDF) 3 Page - NXP Semiconductors

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