Philips Semiconductors

TDA8943SF

6 W mono Bridge Tied Load (BTL) audio amplifier

Product specification

Rev. 02 — 7 April 2000

13 of 20

9397 750 06865

© Philips Electronics N.V. 2000. All rights reserved.

14.1.2

Power supply decoupling

Proper supply bypassing is critical for low-noise performance and high supply voltage

ripple rejection. The respective capacitor locations should be as close as possible to

the device and grounded to the power ground. Proper power supply decoupling also

prevents oscillations.

For suppressing higher frequency transients (spikes) on the supply line a capacitor

with low ESR – typical 100 nF – has to be placed as close as possible to the device.

For suppressing lower frequency noise and ripple signals, a large electrolytic

capacitor – e.g. 1000

µF or greater – must be placed close to the device.

The bypass capacitor on the SVR pin reduces the noise and ripple on the midrail

voltage. For good THD and noise performance a low ESR capacitor is recommended.

Fig 14. Printed-circuit board layout (single-sided); components view.

idth

MGU037

ON

MUTE

220 nF

220 nF

100 nF

1.5 nF

1000

µF

10

µF

1

9

+−

IN

−

IN

+

OUT

+

OUT

−

VCC

GND

54 mm

56 mm