LTC6246/LTC6247/LTC6248

23

Rev C

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2.00

±0.10

(4 SIDES)

NOTE:

1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE

TOP AND BOTTOM OF PACKAGE

0.40

±0.10

BOTTOM VIEW—EXPOSED PAD

0.64

±0.10

(2 SIDES)

0.75

±0.05

R = 0.115

TYP

R = 0.05

TYP

1.37

±0.10

(2 SIDES)

1

4

8

5

PIN 1 BAR

TOP MARK

(SEE NOTE 6)

0.200 REF

0.00 – 0.05

(DC8) DFN 0409 REVA

0.23

±0.05

0.45 BSC

0.25

±0.05

1.37

±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

0.64

±0.05

(2 SIDES)

1.15

±0.05

0.70

±0.05

2.55

±0.05

PACKAGE

OUTLINE

0.45 BSC

PIN 1 NOTCH

R = 0.20 OR

0.25

× 45°

CHAMFER

DC8 Package

8-Lead Plastic DFN (2mm

× 2mm)

(Reference LTC DWG # 05-08-1719 Rev A)

PACKAGE DESCRIPTION

Please refer to http://www.linear.com/product/LTC6246#packaging for the most recent package drawings.