12F615 datasheet(137/168 Pages) MICROCHIP

137 / 168 page

Preliminary

DS41302A-page 135

PIC12F609/615/12HV609/615

15.6

Thermal Considerations

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40°C

≤ TA ≤ +125°C

Param

No.

Sym

Characteristic

Typ

Units

Conditions

TH01

θJA

Thermal Resistance

Junction to Ambient

84.6*

C/W

8-pin PDIP package

163*

C/W

8-pin SOIC package

124*

C/W

8-pin TSSOP package

44*

C/W

8-pin DFN 4x4mm package

TH02

θJC

Thermal Resistance

Junction to Case

41.2*

C/W

8-pin PDIP package

38.8*

C/W

8-pin SOIC package

36.6*

C/W

8-pin TSSOP package

3.0*

C/W

8-pin DFN 3x3mm package

TH03

TDIE

Die Temperature

150*

TH04

Power Dissipation

—

PD = PINTERNAL + PI/O

TH05

PINTERNAL

Internal Power Dissipation

—

PINTERNAL = IDD x VDD

(NOTE 1)

TH06

PI/O

I/O Power Dissipation

—

PI/O =

Σ (IOL * VOL) + Σ (IOH * (VDD - VOH))

TH07

PDER

Derated Power

—

PDER = PDMAX (TDIE - TA)/

θJA

(NOTE 2)

These parameters are characterized but not tested.

Note 1:

IDD is current to run the chip alone without driving any load on the output pins.

12F615 Datasheet(PDF) 137 Page - Microchip Technology

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