12F615 datasheet(157/168 Pages) MICROCHIP

157 / 168 page

Preliminary

DS41302A-page 155

PIC12F609/615/12HV609/615

8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x09 mm Body [DFN]

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Number of Pins

Pitch

Overall Height

Standoff

Contact Thickness

Overall Length

Exposed Pad Width

Overall Width

Exposed Pad Length

Contact Width

Contact Length §

Contact-to-Exposed Pad §

Units

Dimension Limits

0.80

0.00

0.25

0.30

0.20

0.80 BSC

0.90

0.02

0.20 REF

4.00 BSC

2.20

4.00 BSC

3.00

0.30

0.55

—

1.00

0.05

2.80

3.60

0.35

0.65

—

MIN

NOM

MAX

MILLIMETERS

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Package may have one or more exposed tie bars at ends.

3. § Significant Characteristic

4. Package is saw singulated

5. Dimensioning and tolerancing per ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing No. C04–131, Sept. 8, 2006

NOTE 2

TOP VIEW

BOTTOM VIEW

NOTE 1

EXPOSED

PAD

12F615 Datasheet(PDF) 157 Page - Microchip Technology

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