8.3 Power Supply Recommendations

The power supply to the TPS92201 must have a current rating according to the supply voltage, output voltage

and output current.

8.4 Layout

8.4.1 Layout Guidelines

The PCB layout is an important step to maintain the high performance of the TPS92201 device.

• The input/output capacitors and the inductor should be placed as close as possible to the IC. This keeps

the power traces short. Routing these power traces direct and wide results in low trace resistance and low

parasitic inductance.

• The low side of the input and output capacitors must be connected properly to the power GND to avoid a

GND potential shift.

• The sense traces connected to FB are signal traces. Special care should be taken to avoid noise being

induced. Keep these traces away from SW nodes.

• GND layers might be used for shielding.

8.4.2 Layout Example

PWM

FB

EN

GND

VIN

SW

GND

GND

VIN

sw

VOUT

L1

C1

C2

R1

Figure 8-14. TPS92201WSON Layout

PWM

FB

EN

GND

VIN

SW

GND

VIN

sw

VOUT

L1

C1

C2

R1

Figure 8-15. TPS92201SOT Layout

8.4.3 Thermal Considerations

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires

special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow,

convection surfaces, and the presence of other heat-generating components affect the power dissipation limits of

a given component.

Two basic approaches for enhancing thermal performance are listed below:

• Improving the power dissipation capability of the PCB design

• Introducing airflow in the system

For more details on how to use the thermal parameters, see the application notes: Thermal Characteristics

Application Notes SZZA017 and SPRA953.

www.ti.com

TPS92201, TPS92201A

SLVSH40B – NOVEMBER 2023 – REVISED AUGUST 2024

Copyright © 2024 Texas Instruments Incorporated

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Product Folder Links: TPS92201 TPS92201A