Data Sheet

AD8397

Rev. B | Page 7 of 16

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

Supply Voltage

26.4 V

Power Dissipation1

See Figure 4

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature (Soldering, 10 sec)

300°C

Junction Temperature

150°C

1 Thermal resistance for standard JEDEC 4-layer board:

8-lead SOIC_N: θJA = 157.6°C/W

8-Lead SOIC_N_EP: θJA = 47.2°C/W

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

MAXIMUM POWER DISSIPATION

The maximum power that can be dissipated safely by the AD8397

is limited by the associated rise in junction temperature. The

maximum safe junction temperature for plastic encapsulated

devices is determined by the glass transition temperature of the

plastic, approximately 150°C. Temporarily exceeding this limit

may cause a shift in parametric performance due to a change in

the stresses exerted on the die by the package.

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0

–40 –30 –20 –10

0

1020

3040506070

8090

AMBIENT TEMPERATURE (°C)

TJ = 150°C

8-LEAD SOIC

Figure 4. Maximum Power Dissipation vs. Ambient Temperature

ESD CAUTION