MAX26402/MAX26403

36V, 2.5A/3.5A, Fully Integrated Synchronous

Silent Switcher Buck Converters

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Absolute Maximum Ratings

SUP....................................................................-0.3V to +42V

EN ......................................................................-0.3V to +42V

BST to LX..........................................................-0.3V to +2.2V

BST ....................................................................-0.3V to +44V

LX.............................................................. -0.3V to SUP+0.3V

SYNC ...................................................................-0.3V to +6V

FB/OUT ..............................................................-0.3V to +16V

PGOOD................................................................-0.3V to +6V

BIAS ..................................................................-0.3V to +2.2V

SPS .................................................................. -0.3V to +2.2V

PGND to AGND ................................................ -0.3V to +0.3V

ESD Protection Human Body Model ................................ ±2kV

Continuous Power Dissipation (Multilayer Board) (TA = +70°C,

derate 25mW/°C above +70°C.).................................2000mW

Operating Junction Temperature Range ........ -40°C to +150°C

Storage Temperature Range ......................... -65°C to +150°C

Soldering Temperature (Soldering 10s) ....................... +300°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or

any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Information

15 FC2QFN

Package Code

F153B3FY+1

Outline Number

21-100532

Land Pattern Number

90-100188

THERMAL PARAMETERS

4-LAYER JEDEC BOARD

4-LAYER EV KIT

Junction-to-Ambient Thermal Resistance (θJA)

51.1°C/W

40.6°C/W

Junction-to-Case (top) Thermal Resistance (θJCt)

32.7°C/W

—

Junction-to-Case (bottom) Thermal Resistance (θJCb)

21.4°C/W

15.6°C/W

Junction-to-Board Thermal Resistance (θJB)

23.3°C/W

11.7°C/W

Junction-to-Top Characterization Parameter (ΨJT)

1.9°C/W

1.8°C/W

Junction-to-Board Characterization Parameter (ΨJB)

25.5°C/W

17.9°C/W

For the latest package outline information and land patterns (footprints), go to https://www.analog.com/en/design-

center/packaging-quality-symbols-footprints/package-index.html. Note that a “+”, “#”, or “-” in the package code indicates

RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package

regardless of RoHS status.

Package thermal resistances were obtained using JEDEC and the evaluation kit. For detailed information on package

thermal

considerations,

refer

to

https://www.analog.com/en/technical-articles/thermal-characterization-of-ic-

packages.html.