Philips Semiconductors

Z0103/07/09 series

Triacs

Product data

Rev. 02 — 12 September 2002

4 of 12

9397 750 10102

© Koninklijke Philips Electronics N.V. 2002. All rights reserved.

5.

Thermal characteristics

5.1 Transient thermal impedance

Table 4:

Thermal characteristics

Symbol

Parameter

Conditions

Min Typ Max Unit

thermal resistance from junction to solder

point for SOT223

Figure 5

--25

K/W

thermal resistance from junction to lead for

SOT54B (TO-92)

Figure 5

--60

K/W

thermal resistance from junction to ambient

SOT223

minimum footprint; mounted on a PCB

-

60

-

K/W

SOT54B (TO-92)

vertical in free air

-

150 -

K/W

for SOT54B (TO-92)

for SOT223

Fig 5.

Transient thermal impedance from junction to lead and junction to solder point as a function of pulse

duration.

a

110

tp (s)

10

1

SOT223

SOT54B

003aaa206

a

Z

th j

lead

–

()

R

th j

lead

–

()

---------------------------

=

a

Z

th j

sp

–

()

R

th j

sp

–

()

-----------------------

=