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TLV3603MDBVTEP Datasheet(PDF) 4 Page - Texas Instruments

Part # TLV3603MDBVTEP
Description  TLV3603-EP Enhanced Product 325MHz High-Speed Comparator with 2.5ns Propagation Delay
PDF  28 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TLV3603MDBVTEP Datasheet(HTML) 4 Page - Texas Instruments

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5 Specifications
5.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
Input Supply Voltage: VCC – VEE
–0.3
6
V
Input Voltage (IN+, IN–)(2)
VEE – 0.3
VCC + 0.3
V
Differential Input Voltage (VDI = IN+ – IN–)
–(VCC – VEE + 0.3) + (VCC –VEE + 0.3)
V
Output Voltage (OUT)(3)
VEE – 0.3
VCC + 0.3
V
Latch and Hysteresis Control (LE/HYS)
VEE – 0.3
VCC + 0.3
V
Current into Input pins (IN+, IN–, LE/HYS)(2)
±10
mA
Current into Output pins (OUT)(3)
±50
mA
Junction temperature, TJ
150
°C
Storage temperature, Tstg
–65
150
°C
(1)
Operation outside the Absolute Maximum Ratings can cause permanent device damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.
If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully
functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2)
Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3V beyond the supply rails must
be current-limited to 10mA or less.
(3)
Output terminals are diode-clamped to the power-supply rails. Output signals that can swing more than 0.3V beyond the supply rails
must be current-limited to 50mA or less.
5.2 ESD Ratings
VALUE
UNIT
TLV3603-EP
V(ESD)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
V(ESD)
Electrostatic
discharge
Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)
±1000
V
(1)
JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.
5.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
Input Supply Voltage: VCC – VEE
2.4
5.5
V
Input Voltage Range (IN+, IN–)
VEE – 0.3
VCC + 0.3
V
Latch and Hysteresis Control (LE/HYS)
VEE – 0.3
VCC + 0.3
V
Ambient temperature, TA
–55
125
°C
5.4 Thermal Information
THERMAL METRIC(1)
TLV3603-EP
UNIT
DBV (SOT-23)
6 PINS
RθJA
Junction-to-ambient thermal resistance
191.1
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
117.1
°C/W
RθJC(bottom)
Junction-to-case (bottom) thermal resistance
79.1
°C/W
RθJB
Junction-to-board thermal resistance
56.7
°C/W
ψJT
Junction-to-top characterization parameter
78.8
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics report.
TLV3603-EP
SNOSDK3 – SEPTEMBER 2024
www.ti.com
4
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Copyright © 2024 Texas Instruments Incorporated
Product Folder Links: TLV3603-EP



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