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TLV3603MDBVTEP Datasheet(PDF) 4 Page - Texas Instruments |
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TLV3603MDBVTEP Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 28 page ![]() 5 Specifications 5.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT Input Supply Voltage: VCC – VEE –0.3 6 V Input Voltage (IN+, IN–)(2) VEE – 0.3 VCC + 0.3 V Differential Input Voltage (VDI = IN+ – IN–) –(VCC – VEE + 0.3) + (VCC –VEE + 0.3) V Output Voltage (OUT)(3) VEE – 0.3 VCC + 0.3 V Latch and Hysteresis Control (LE/HYS) VEE – 0.3 VCC + 0.3 V Current into Input pins (IN+, IN–, LE/HYS)(2) ±10 mA Current into Output pins (OUT)(3) ±50 mA Junction temperature, TJ 150 °C Storage temperature, Tstg –65 150 °C (1) Operation outside the Absolute Maximum Ratings can cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3V beyond the supply rails must be current-limited to 10mA or less. (3) Output terminals are diode-clamped to the power-supply rails. Output signals that can swing more than 0.3V beyond the supply rails must be current-limited to 50mA or less. 5.2 ESD Ratings VALUE UNIT TLV3603-EP V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V V(ESD) Electrostatic discharge Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002(2) ±1000 V (1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process. 5.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Input Supply Voltage: VCC – VEE 2.4 5.5 V Input Voltage Range (IN+, IN–) VEE – 0.3 VCC + 0.3 V Latch and Hysteresis Control (LE/HYS) VEE – 0.3 VCC + 0.3 V Ambient temperature, TA –55 125 °C 5.4 Thermal Information THERMAL METRIC(1) TLV3603-EP UNIT DBV (SOT-23) 6 PINS RθJA Junction-to-ambient thermal resistance 191.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 117.1 °C/W RθJC(bottom) Junction-to-case (bottom) thermal resistance 79.1 °C/W RθJB Junction-to-board thermal resistance 56.7 °C/W ψJT Junction-to-top characterization parameter 78.8 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics report. TLV3603-EP SNOSDK3 – SEPTEMBER 2024 www.ti.com 4 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated Product Folder Links: TLV3603-EP |
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