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CY2037
Document #: 38-07354 Rev. *D
Page 2 of 10
XG
PD#/OE
XD
CONFIGURATION
CRYSTAL
CLKOUT
/ 1, 2, 4, 8, 16, 32, 64, 128
OSCILLATOR
or FS
MUX
HIGH
ACCURACY
PLL
EPROM
Logic Block Diagram
X
Y
VD D
VD D
XD
XG
PD # /O E o r F S
N/C
CL K O U T
VSS
VSS
H o r iz ont a l sc r ib e
XX
N/C
XR
De v ic e Na m e
V e r tic al sc r ib e
Note:
Active Die Size: X = 55.9 mils / 1420.1
μm
Bond pad opening: 85
μm x 85 μm
Pad pitch: 125
μm x 125 μm
(Pad center to pad center)
Scribe: X (horizontal)= 2.6 mils / 65.6
μm
Y (vertical)= 3.0 mils / 76.9
μm
Die Pad Description
Note
2. For Customers not bonding the XD or XG pad to external pins, an alternative bonding option would be shorting the Xx pad to the XD pad
Die Pad Summary
Name
Die
Pad
Description
X Coordinate
(
μm)
Y Coordinate
(
μm)
VDD
1,2
Voltage supply
124.7
855.6 , 731
VSS
8,9
Ground
1291.35
99.6 , 225.2
XD
4
Crystal connection.
124.7
481.8
XX
3
No Connect [2]
124.7
606.4
XG
6
Crystal connection.
124.7
232.6
PD#/OE
or FS
7
CY2037A, CY2037B, and CY2037-2—EPROM programmable power
down or output enable pad. CY2037-3—Frequency Select.
Serves as VPP in programming mode for all devices.
124.7
108
CLKOUT
11
Clock output. Also serves as three-state input during programming.
1282.45
901.8
N/C
5,10
No Connect. (Do not bond to these pads)
124.7,1282.45
357.2, 769.4
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