6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VCC

Supply voltage

–0.5

7

V

IIK

Input clamp current(2)

VI < 0 or VI > VCC

±20

mA

IOK

Output clamp current(2)

VO < 0 or VO > VCC

±20

mA

IO

Continuous output current

VO = 0 to VCC

±35

mA

ICC

Continuous current through VCC or GND

±70

mA

TJ

Junction temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated

under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per AEC Q100-002(1)

HBM ESD Classification Level 2

±4000

V

Charged device model (CDM), per AEC

Q100-011

CDM ESD Classification Level C4B

±1500

(1)

AEC Q100-002 indicate that HBM stressing shall be in accordrance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCC

Supply voltage

2

5

6

V

VI

Input voltage

0

VCC

V

VO

Output voltage

0

VCC

V

TA

Ambient temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

SN74HCS126

UNIT

D (SOIC)

PW (TSSOP)

14 PINS

14 PINS

RθJA

Junction-to-ambient thermal resistance

133.6

151.7

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

89

79.4

°C/W

RθJB

Junction-to-board thermal resistance

89.5

94.7

°C/W

ΨJT

Junction-to-top characterization parameter

45.5

25.2

°C/W

ΨJB

Junction-to-board characterization parameter

89.1

94.1

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

SN74HCS126

SCLS798B – JUNE 2020 – REVISED MAY 2023

www.ti.com

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