data sheet

LQFP

LEADFRAME

www.amkor.com

Low Profile Quad Flat

Pack (LQFP) Packages:

Amkor offers a broad line of LQFP IC packages

designed to provide the same great benefits

as MQFP packaging with a 1.4 mm body

thickness. This allows IC packaging engineers,

component specifiers and systems designers

to solve issues such as increasing board

density, die shrink programs, thin end-product

profile and portability.

Applications:

Amkor’s LQFPs are an ideal IC package for

most IC semiconductor technologies such as

ASIC, DSP, controllers, processors, gate arrays

(FPGA/PLD), SRAMs and PC chip sets.

LQFPs are particularly suited for light weight,

portable electronics requiring broad perform-

ance characteristics. Such applications are lap-

top PCs, video/audio, telecom, cordless/RF,

data acquisition, office equipment, disc-drives

and communication boards.

Amkor’s LQFP packaging portfolio provides:

• 7 x 7 mm to 28 x 28 mm body size

• 32 to 256 lead counts

• Copper leadframes

• Broad selection of die pad sizes

• Custom leadframe design available

• 1.4 mm body thickness

• Low stress die attach adhesive

• Rapid cure mold compound

Single-Layer PCB

Theta JA (°C/W) by Velocity (LFPM)

Pkg

Body Size (mm) Pad Size (mm)

0

200

500

32 ld

7 x 7

5 x 5

67.8

55.9

50.1

100 ld

14 x 14

8 x 8

41.5

33.4

29.5

100 ld

14 x 20

9.5 x 9.5

39.7

31.8

28.3

144 ld

20 x 20

8.5 x 8.5

38.0

31.2

28.1

176 ld

24 x 24

8 x 8

38.3

31.9

29.0

JEDEC Standard Test Boards

Multi-Layer PCB

Theta JA (°C/W) by Velocity (LFPM)

Pkg

Body Size (mm) Pad Size (mm)

0

200

500

32 ld

7 x 7

5 x 5

47.9

42.1

39.4

100 ld

14 x 14

8 x 8

31.7

26.8

24.7

100 ld

14 x 20

9.5 x 9.5

30.0

25.1

23.0

144 ld

20 x 20

8.5 x 8.5

31.7

26.9

24.9

176 ld

24 x 24

8 x 8

31.9

27.3

25.4

208 ld*

28 x 28

16 x 16

18.1

15.3

14.4

*Pre-JEDEC Standard Test Boards

Tested @ 1 W

All others - JEDEC Standard Test Boards

Body Size PadSize

Inductance Capacitance Resistance

Pkg

(mm)

(mm)

Lead

(nH)

(pF)

(mΩ)

32 ld

7 x 7

5 x 5

Longest

0.904

0.211

9.2

Shortest

0.799

0.202

7.8

48 ld

7 x 7

5 x 5

Longest

1.110

0.225

13.8

Shortest

0.962

0.200

12.0

100 ld 14 x 14

8 x 8

Longest

2.300

0.419

26.3

Shortest

1.520

0.322

17.8

144 ld 20 x 20 8.5 x 8.5 Longest

6.430

1.100

62.9

Shortest

4.230

1.070

52.6

176 ld 24 x 24

8 x 8

Longest

9.510

1.270

89.0

Shortest

5.200

1.340

64.0

208 ld 28 x 28 11 x 11 Longest

9.670

1.380

86.2

Shortest

6.190

1.210

64.8

Simulated Results @ 100 MHz

IC chips are assembled in optimized package designs with proven reliable

semiconductor materials.

• Moisture sensitivity

JEDEC Level 3

characterization

30 °C/60%RH, 192 hrs

• PCT

121 °C, 100%RH, 2 atm, 504 hours

• Temp cycle

-55/+125 ° C, 1000 cycles

• Temp/humidity

85 °C/85% RH, 1000 hours

• High temp storage

150 °C, 1000 hours

Features:

Thermal Resistance:

Electrical:

Reliability:

VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND

TO VIEW THE MOST CURRENT PRODUCT INFORMATION

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DS232B

Rev Date: 08’00