LQFP Nominal Package Dimensions (units in mm)

LQFP

LEADFRAME

Process Highlights

Die thickness

14.5 ± .5 mil

Strip solder plating

85/15 Sn/Pb

Marking

Laser

Lead inspection

Laser/optical

Pack/ship options

Bar code, dry pack

Wafer backgrinding

Available

Test Services

• Program generation/conversion

• Product engineering

• Wafer sort

• 256 Pin x 20 MHz test system available

• -55 °C to +165 °C test available

• Burn-in

Shipping

JEDEC outline CO-124 low profile tray

data sheet

With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or

damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard

terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.

www.amkor.com

Configuration Options:

BBooddyy

BBooddyy

LLeeaadd

FFoooott

TTrraayy

UUnniittss

SSiizzee

TTkknnss

FFoorrm

m

SSttaannddooffff

LLeennggtthh

TTiipp TToo TTiipp

LLeeaadd CCoouunntt

JJEEDDEECC

M

Maattrriixx

PPeerr TTrraayy

7 x 7

1.40

1.00

0.10

0.60

9.0

32/48/64

MS-026

10 x 25

250

10 x 10

1.40

1.00

0.10

0.60

12.0

44/52/64/80

MS-026

8 x 20

160

14 x 14

1.40

1.00

0.10

0.60

16.0

44/64/80/100/120/128

MS-026

6 x 15

90

14 x 20

1.40

1.00

0.10

0.60

16.0 x 22.0

100/128

MS-026

6 x 12

72

20 x 20

1.40

1.00

0.10

0.60

22.0

128/144/176

MS-026

5 x 12

60

24 x 24

1.40

1.00

0.10

0.60

26.0

160/176/216

MS-026

4 x 10

40

28 x 28

1.40

1.00

0.10

0.60

30.0

160/208/256

MS-026

4 x 9

36

Cross-section LQFP

Die Attach Pad

Gold Wire

Mold

Compound

Die Attach

Adhesive

Leadframe