10 / 12 page

Rev 1.1, May 29, 2007
Page 10 of 12
SL2309
Package Drawing and Dimensions
16-Lead TSSOP (4.4mm)
0.190(0.007)
0.300(0.012)
0.090(0.003)
0.200(0.008)
8
9
6.250(0.246)
6.500(0.256)
4.300(0.169)
4.500(0.177)
2.900(0.114)
3.100(0.122)
0.850(0.033)
0.950(0.037)
0.050(0.002)
0.150(0.006)
1.100(0.043) MAX
0.076(0.003)
0 to 8°
0.500(0.020)
0.700(0.027)
0.650(0.025)
BSC
Gauge
Plane
Dimensions are in milimeters(inches).
Top line: (MIN) and Bottom line: (Max)
Pin-1 ID
Seating Plane
1
16
0.650(0.025)
BSC
Thermal Characteristics
Parameter
Symbol
Condition
Min
Typ
Max
Unit
θ JA
Still air
-
80
-
°C/W
θ JA
1m/s air flow
-
70
-
°C/W
Thermal Resistance
Junction to Ambient
θ JA
3m/s air flow
-
68
-
°C/W
Thermal Resistance
Junction to Case
θ JC
Independent of air flow
-
36
-
°C/W