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Rev 1.1, May 29, 2007
Page 11 of 12
SL2309
Package Drawing and Dimensions (Cont.)
8
0.150(3.810)
0.157(3.987
0.230(5.842)
0.244(6.197)
0.189(4.800)
0.196(4.978)
0.050(1.270)
BSC
0.004(0.102)
Seating plane
0.004(0.102)
0.0098(0.249)
0.061(1.549)
0.068(1.727)
0° to 8°
0.010(0.2540)
0.016(0.406) X 45°
0.016(0.406)
0.035(0.889)
0.0075(0.190)
0.0098(0.249)
Pin-1 ID
Dimensions are in milimeters(inches).
Top line: (MIN) and Bottom line: (Max)
16-Lead SOIC (150 Mil)
1
9
16
0.0138(0.350)
0.0192(0.487)
Thermal Characteristics
Parameter
Symbol
Condition
Min
Typ
Max
Unit
θ JA
Still air
-
120
-
°C/W
θ JA
1m/s air flow
-
115
-
°C/W
Thermal Resistance
Junction to Ambient
θ JA
3m/s air flow
-
105
-
°C/W
Thermal Resistance
Junction to Case
θ JC
Independent of air flow
-
60
-
°C/W