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TS8405P Datasheet(PDF) 12 Page - Taiwan Semiconductor Company, Ltd |
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TS8405P Datasheet(HTML) 12 Page - Taiwan Semiconductor Company, Ltd |
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12 / 12 page ![]() Dimensional Outline and Pad Layout PRELIMINARY DATA SHEET 0.80mm 0.80mm Ø 0.30mm Solder Mask Ø ~ 0.40mm LAND PATTERN RECOMMENDATION DD S G D = Drain Pad S = Source Pad G = Gate Pad SILICON 0.80mm MAX 0.27mm 0.80mm 1.50mm 0.80mm 0.35mm 0.35mm Bump Ø 0.37mm 1.50mm 11 EXXXX BACKSIDE VIEW (NO BUMP SIDE VIEW) Mark on backside of die E = 8405P Product Code XXXX = Lot Traceability Code Mark is located in lower right quadrant on top of Source pad. Gate pad is located in lower left quadrant. Bumps are Eutectic solder 63/37 Sn/Pb 9/14/03 Rev5 |
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