±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,

Up to 1Mbps, True RS-232 Transceivers

2

_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

V+ to GND (Note 1) ..................................................-0.3V to +7V

V- to GND (Note 1) ...................................................+0.3V to -7V

V+ + |V-| (Note 1).................................................................+13V

Input Voltages

T_IN, EN, SHDN, MBAUD to GND ........................-0.3V to +6V

R_IN to GND .....................................................................±25V

Output Voltages

T_OUT to GND...............................................................±13.2V

Short-Circuit Duration, T_OUT to GND.......................Continuous

16-Pin SSOP (derate 7.14mW/°C above +70°C) ..........571mW

16-Pin Wide SO (derate 9.52mW/°C above +70°C) .....762mW

18-Pin Wide SO (derate 9.52mW/°C above +70°C) .....762mW

18-Pin PDIP (derate 11.11mW/°C above +70°C)..........889mW

20-Pin TSSOP (derate 10.9mW/°C above +70°C) ........879mW

20-Pin SSOP (derate 8.00mW/°C above +70°C) ..........640mW

28-Pin SSOP (derate 9.52mW/°C above +70°C) ..........762mW

28-Pin Wide SO (derate 12.50mW/°C above +70°C) .............1W

28-Pin TSSOP (derate 12.8mW/°C above +70°C) ......1026mW

32-Lead QFN (derate 23.2mW/°C above +70°C) .........1860mW

6 x 6 UCSP (derate 12.6mW/°C above +70°C) .............1010mW

Operating Temperature Ranges

MAX32_ _EC_ _ ...................................................0°C to +70°C

MAX32_ _EE_ _.................................................-40°C to +85°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Bump Reflow Temperature (Note 2)

Infrared, 15s..................................................................+200°C

Vapor Phase, 20s..........................................................+215°C

Note 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.

Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device

can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-

mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.

Preheating is required. Hand or wave soldering is not allowed.

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

MAX3222E, MAX3232E,

MAX3241E, MAX3246E

0.3

1

Supply Current

MAX3237E

0.5

2.0

mA

SHDN = GND

1

10

µA

Shutdown Supply Current

10

300

nA

LOGIC INPUTS

Input Logic Low

T_IN, EN, SHDN, MBAUD

0.8

V

2.0

Input Logic High

T_IN, EN, SHDN, MBAUD

2.4

V

Transmitter Input Hysteresis

0.5

V

T_IN, EN, SHDN

MAX3222E, MAX3232E,

MAX3241E, MAX3246E

±0.01

±1

Input Leakage Current

T_IN, SHDN, MBAUD

MAX3237E (Note 5)

9

18

µA

RECEIVER OUTPUTS

Output Leakage Current

R_OUT (MAX3222E/MAX3237E/MAX3241E/

±0.05

±10

µA

Output Voltage Low

IOUT = 1.6mA (MAX3222E/MAX3232E/MAX3241E/

MAX3246E), IOUT = 1.0mA (MAX3237E)

0.4

V