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LMC6035 Datasheet(PDF) 24 Page - Texas Instruments |
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LMC6035 Datasheet(HTML) 24 Page - Texas Instruments |
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24 / 44 page ![]() 7.3.1.2 DSBGA Considerations Unlike other small packages, the DSBGA package does not follow the trend of smaller packages having greater thermal resistance. The LMC6035 in DSBGA has a thermal resistance of 103.1°C/W compared to 149.2°C/W in VSSOP. Even when driving a 600Ω load and operating from ±7.5V supplies, the maximum temperature rise is less than 2°C. For application information specific to the DSBGA package, see the AN-1112 DSBGA Wafer Level Chip Scale Package application report. 7.3.2 Layout Example Figure 7-14. Layout Example: Using the LMC603x Guard Ring in PCB Layout LMC6035, LMC6036 SNOS875H – JANUARY 2000 – REVISED DECEMBER 2024 www.ti.com 24 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated Product Folder Links: LMC6035 LMC6036 |
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