THERMAL METRIC(1)

SN74LVC74A-Q1

UNIT

BQA

(WQFN)

D

(SOIC)

PW

(TSSOP)

14 PINS

14 PINS

14 PINS

ψJB

Junction-to-board characterization parameter

70.9

83.9

93.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

50.1

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

4.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

VCC

MIN

TYP(1) MAX

UNIT

VOH

IOH = –100 μA

2.7 V to 3.6 V

VCC – 0.2

V

IOH = –12 mA

2.7 V

2.2

3 V

2.4

IOH = –24 mA

3 V

2.2

VOL

IOL = 100 μA

2.7 V to 3.6 V

0.2

V

IOL = 12 mA

2.7 V

0.4

IOL = 24 mA

3 V

0.55

II

VI = 5.5 V or GND

3.6 V

±5

μA

ICC

VI = VCC or GND,

IO = 0

3.6 V

10

μA

ΔICC

One input at VCC – 0.6 V, Other inputs at VCC or GND

2.7 V to 3.6 V

500

μA

Ci

VI = VCC or GND

3.3 V

5

pF

(1)

All typical values are at VCC = 3.3 V, TA = 25°C.

4.6 Timing Requirements

over recommended operating free-air temperature range (unless otherwise noted) (see Load Circuit and Voltage Waveforms)

VCC = 2.7 V

VCC = 3.3 V

± 0.3 V

UNIT

MIN MAX

MIN

MAX

fclock

Clock frequency

83

100

MHz

tw

Pulse duration

PRE or CLR low

3.3

3.3

ns

CLK high or low

3.3

3.3

tsu

Setup time before CLK↑

Data

3.4

3

ns

PRE or CLR inactive

2.2

2

th

Hold time, data after CLK↑

1

1

ns

4.7 Switching Characteristics

over recommended operating free-air temperature range (unless otherwise noted) (see Load Circuit and Voltage Waveforms)

PARAMETER

FROM

(INPUT)

TO

(OUTPUT)

VCC = 2.7 V

VCC = 3.3 V

± 0.3 V

UNIT

MIN MAX

MIN

MAX

fmax

83

100

MHz

tpd

CLK

Q or Q

6

1

5.2

ns

PRE or CLR

6.4

1

5.4

www.ti.com

SN74LVC74A-Q1

SCES481E – AUGUST 2003 – REVISED AUGUST 2024

Copyright © 2024 Texas Instruments Incorporated

Submit Document Feedback

5

Product Folder Links: SN74LVC74A-Q1