Preliminary Datasheet
SMB365
Three-axis accelerometer
Bosch Sensortec
Triaxial
±2g/±10g Accelerometer SMB365
KEY FEATURES
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Three-axis accelerometer
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Switchable g-range (2g/10g)
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Standard SMD package: QFN 4.0x4.0 mm2 footprint, 1.2mm height
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4mg resolution at 50Hz bandwidth
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Ultra-low power ASIC: 600
µA at VDD 2.5V
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SPI interface
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Interrupt feature for mobile wake-up or zero-g detection (free fall)
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Full self-test capability
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RoHS lead-free compliant
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Based on automotive-proven Bosch Silicon Surface Micromachining Process
TYPICAL APPLICATIONS
Tilt, motion and vibration sensing in
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Cell phones
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Handhelds
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Computer peripherals
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Man-machine interfaces
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Virtual reality
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Games
GENERAL DESCRIPTION
The SMB365 is a triaxial low-g acceleration sensor for consumer market applications. It allows
measurements of static as well as dynamic accelerations. Due to its three perpendicular axes it
gives the absolute orientation in a gravity field. As all other Bosch inertial sensors, it is a two-
chip arrangement. An application-specific IC evaluates the output of a three-channel microme-
chanical acceleration-sensing element that works according to the differential capacitance prin-
ciple. The underlying micromachining process has proven its capability in more than 100 million
Bosch accelerometers and gyroscopes so far.
The SMB365 provides a digital 10bit output signal via an SPI interface. With an appropriate SPI
command the full measurement range can be chosen to 2g or 10g. A first-order filter with a
pole-frequency of 50Hz is included to provide preconditioning of the measured acceleration
signal. Typical noise level and quantization lead to a sensitivity resolution of 4mg or an accuracy
of 0.3° in an inclination sensing application, respectively. The current consumption is typically
600
µA at a supply voltage of 2.5V. Furthermore, the sensor can be switched into a low-power
mode where it informs the host system about an acceleration change via an interrupt pin. This
feature can be used to wake-up the host system from a sleep mode.
The sensor also features full self-test capability. It is activated via SPI command which results in
a physical deflection of the seismic mass in the sensing element due to an electrostatic force.
Thus, it provides full testing of the complete signal evaluation path including the micromachined
sensor structure and the evaluation ASIC.
The sensor is available in a standard SMD QFN package with a footprint of 4x4mm2 and a
height of 1.2mm.
Rev. 1.2
Page 1
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as
copying and passing on to third parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
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