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M58PR256J Datasheet(PDF) 9 Page - STMicroelectronics

Part # M58PR256J
Description  256 Mbit or 512 Mbit (x16, Multiple Bank, Multilevel, Burst) 1.8 V supply Flash memories
PDF  114 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

M58PR256J Datasheet(HTML) 9 Page - STMicroelectronics

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M58PR256J, M58PR512J
Description
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1
Description
The M58PR256J and M58PR512J are 256 Mbit (16 Mbit ×16) and 512 Mbit (32 Mbit ×16)
non-volatile Flash memories, respectively. They are referred to as M58PRxxxJ in the rest of
the document unless otherwise specified.
The M58PRxxxJ may be erased electrically at Block level and programmed in-system on a
Word-by-Word basis using a 1.7 V to 2.0 V VDD supply for the circuitry and a 1.7 V to 2.0 V
VDDQ supply for the Input/Output pins. An optional 9 V VPP power supply is provided to
speed up factory programming.
The M58PRxxxJ has a uniform Block architecture and is based on a Multi-Level cell
technology.
The M58PR256J has an array of 128 Blocks, and is divided into 32 Mbit banks. There are 8
banks each containing 16 Blocks of 128 KWords.
The M58PR512J has an array of 256 Blocks, and is divided into 64 Mbit banks. There are 8
Banks each containing 32 Blocks of 128 KWords.
Each Block contains 256 Program Regions of 1 KByte each, that are divided into 32
Segments of 16 Words. Each Segment is split into two halves (A and B), according by the
value on Address Input A3.
The memory map is illustrated in Figure 2, and the Main Array architecture in Figure 3.
The Multiple Bank Architecture allows Dual Operations, while programming or erasing in
one bank, read operations are possible in other banks. Only one bank at a time is allowed to
be in program or erase mode. It is possible to perform burst reads that cross bank
boundaries. The bank architecture is summarized in Table 2, and the memory maps are
shown in Figure 2.
Each Block can be erased separately. Erase can be suspended, in order to perform a
program or read operation in any other Block, and then resumed. Program can be
suspended to read data at any memory location except for the one being programmed, and
then resumed. Each Block can be programmed and erased over 100,000 cycles using the
supply voltage VDD. There is a Buffer Enhanced Factory programming command available
to speed up programming.
Program and erase commands are written to the Command Interface of the memory. An
internal Program/Erase Controller takes care of the timings necessary for program and
erase operations. The end of a program or erase operation can be detected and any error
conditions identified in the Status Register. The command set required to control the
memory is consistent with JEDEC standards.
The device supports Synchronous Burst Read and Asynchronous Read from all Blocks of
the memory array; at power-up the device is configured for Asynchronous Read. In
Synchronous Burst Read mode, data is output on each clock cycle at frequencies of up to
108 MHz. The Synchronous Burst Read operation can be suspended and resumed.
The device features an Automatic Standby mode and Deep Power-Down mode. When the
bus is inactive during Asynchronous Read operations, the device automatically switches to
the Automatic Standby mode. In this condition the power consumption is reduced to the
standby value and the outputs are still driven.



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