LX1675 datasheet(2/19 Pages) MICROSEMI

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LX1675

PRODUCTION DATA SHEET

Microsemi

Integrated Products Division

11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570

Page 2

Rev. 1.2a, 2006-02-16

Multiple Output LoadSHARE™ PWM

ABSOLUTE MAXIMUM RATINGS

Supply Voltage (VIN, VSLR, HRX) ............................................................... -0.3V to 24V

Supply Voltage (VCCL) ................................................................................ -0.3V to 6.0V

Driver Supply Voltage (VCX) ........................................................................ -0.3V to 30V

Current Sense Inputs (CSX)............................................................................ -0.3V to 30V

Error Amplifier Inputs (FBX, RF2, LDFB) .................................................... -0.3V to 5.5V

Internal regulator Current (IVCCL)............................................................................... 50mA

Output Drive Peak Current Source (HOX, LOX) ................................................ 1A (200ns)

Output Drive Peak Current Sink (HOX, LOX) ................................................. 1.5A (200ns)

Differential Voltage: VHOX – VHRX (High Side Return) .................................... -0.3V to 6V

Soft Start Input (SSX, SSL) ............................................................................-0.3V to VREF

Logic Inputs (SF, FS)..........................................................................-0.3V to VCCL + 0.5V

LDO Gate Drive (LDGD) Output Drive can source .................................................. 10mA

LDO Feedback (LDFB) Input.......................................................................................6.0V

Operating Junction Temperature................................................................................ 150°C

Operating Temperature Range .......................................................................-40°C to 85°C

Storage Temperature Range.........................................................................-65

°C to 150°C

Peak Package Solder Reflow Temp. (40 seconds maximum exposure) ......... 260°C (+0 -5)

Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to

Ground. Currents are positive into, negative out of specified terminal

Limitations affecting transient pulse duration is thermally related to the clamping zener

diodes connected to the supply pins, application of maximum voltage will increase current

into that pin and increase power dissipation.

x denotes respective pin designator 1, 2, or 3.

TH ERMAL DATA

LQ Plastic MLPQ 38-Pin

THERMAL RESISTANCE

-JUNCTION TO AMBIENT,

30 to 55

°C/W

Junction Temperature Calculation: TJ = TA + (PD x θJA).

The

JA numbers are dependent on heat spreading and layout considerations for the thermal

performance of the device/pc-board system. All of the above assume no ambient airflow.

PACKAGE PIN OUT

LO2

HR2

HO2

VC2

CS2

EO2

SS2

RF2

EO1

FB1

SS3

FB3

EO3

CS3

DGND

CS1

VIN

VCCL

PG3

LO3

FB2

HR3

Connect Bottom to

Power GND

LQ PACKAGE

(Top View)

RoHS / Pb-free 100% Matte Tin Lead Finish

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