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BUF22821 Datasheet(PDF) 2 Page - Texas Instruments |
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BUF22821 Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 25 page ![]() www.ti.com ABSOLUTE MAXIMUM RATINGS (1) BUF22821 SBOS399 – JUNE 2007 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) PRODUCT PACKAGE PACKAGE DESIGNATOR PACKAGE MARKING BUF22821 HTSSOP-38 DCP BUF22821 (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Over operating free-air temperature range (unless otherwise noted). BUF22821 UNIT Supply Voltage, VS +22 V Supply Voltage, VSD +6 V Digital Input Terminals, SCL, SDA, AO, BKSEL: Voltage –0.5 to +6 V Digital Input Terminals, SCL, SDA, AO, BKSEL: Current ±10 mA Analog Input Terminals, STATINL, STATINH: Voltage –0.5 to VS + 0.5 V Analog Input Terminals, STATINL, STATINH: Current ±10 mA Output Short-Circuit(2) Continuous Operating Temperature –40 to +95 °C Storage Temperature –65 to +150 °C Junction Temperature +125 °C Human Body Model 4000 V ESD Ratings Charged-Device Model 1000 V Machine Model 200 V (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Short-circuit to ground, one channel at a time. 2 Submit Documentation Feedback |
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