ADV7403

Rev. SpA | Page 21 of 24

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MS-026-BED

TOP VIEW

(PINS DOWN)

1

25

26

51

50

75

76

100

0.50

BSC

LEAD PITCH

0.27

0.22

0.17

1.60 MAX

0.75

0.60

0.45

VIEW A

PIN 1

1.45

1.40

1.35

0.15

0.05

0.20

0.09

0.08

COPLANARITY

VIEW A

ROTATED 90° CCW

SEATING

PLANE

7°

3.5°

0°

14.20

14.00 SQ

13.80

16.20

16.00 SQ

15.80

Figure 10. 100-Lead Low Profile Quad Flat Package [LQFP]

(ST-100)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

−40°C to +85°C

100-Lead Low Profile Quad Flat Package (LQFP)

ST-100

0°C to 70°C

100-Lead Low Profile Quad Flat Package (LQFP)

ST-100

EVAL-ADV7403EBM

Evaluation board

device is 100% pure Sn electroplate. The device is suitable for Pb-free applications, and is able to withstand surface-mount soldering at up to 255°C (±5°C). In addition,

it is backward-compatible with conventional SnPb soldering processes. This means that the electroplated Sn coating can be soldered with SnPb solder pastes at

conventional reflow temperatures of 220°C to 235°C.