Advanced CMOS Logic – 74AC244

 

Octal 3-State Non-Inverting Buffer / Line Driver / Line Receiver in bare die form

Rev 1.0

24/04/19

Outputs Source/Sink 24mA

Low input current: 1µA

3-State outputs

 

 

 

 

Outputs directly interface CMOS, NMOS and TTL

Operating voltage range: 2.0V to 6.0V

 

 

 

 

 

Lower power consumption & higher speed

Function compatible with 74HC244

Features:

Ordering Information

The following part suffixes apply:

 

No suffix - MIL-STD-883 /2010B Visual Inspection

 

 

 

For High Reliability versions of this product please see

 

54AC244

 

 

 

 

Die Size (Unsawn)

1750 x 1700

 

 

 

 

69 x 67

µm

mils

Supply Formats:

Mechanical Specification

Default – Die in Waffle Pack (100 per tray capacity)

Sawn Wafer on Tape – On request

130 x 130

Minimum Bond Pad Size

5.12 x 5.12

µm

mils

Die Thickness

350 (±20)

13.78 (±0.79)

µm

mils

Top Metal Composition

Al 1%Si 1.1µm

Back Metal Composition

N/A – Bare Si

Unsawn Wafer – On request

Die Thickness <> 350µm(14 Mils) – On request

Assembled into Ceramic Package – On request

The 74AC244 is produced on a 1.5µm 5V CMOS process

combining high speed LSTTL performance with CMOS low

power. The device can be used as two 4-bit buffers or one

8-bit buffer & features non-inverting inputs with two output

enables, each controlling four of the 3-state outputs. The

device is designed to improve performance & density in

clock drivers, 3-state memory address drivers & bus

orientated transmitters and receivers. Inputs include clamp

diodes that enable the use of current limiting resistors to

interface inputs to voltages in excess of VCC. Device inputs

directly accept TTL without use of pull-up resistors.

Description

Die Dimensions in µm (mils)

1750 (69)

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