6

S70GL-P MirrorBit

S70GL-P_00_01 December 4, 2006

Data

Sheet

(Adv an ce

Inf o r m a t io n)

2.2

LSE064—64 ball Fortified Ball Grid Array, 13 x 11 mm

Figure 2.2 LSE064—64-ball Fortified Ball Grid Array (FBGA), 13 x 11 mm

3611 \ 16-038.15 \ 11.13.6

PACKAGE

LSE 064

JEDEC

N/A

D x E

13.00 mm x 11.00 mm

PACKAGE

SYMBOL

MIN

NOM

MAX

NOTE

A

---

---

1.40

PROFILE

A1

0.40

---

---

BALL HEIGHT

A2

0.79

---

0.91

BODY THICKNESS

D

13.00 BSC.

BODY SIZE

E

11.00 BSC.

BODY SIZE

D1

7.00 BSC.

MATRIX FOOTPRINT

E1

7.00 BSC.

MATRIX FOOTPRINT

MD

8

MATRIX SIZE D DIRECTION

ME

8

MATRIX SIZE E DIRECTION

n

64

BALL COUNT

Øb

0.50

0.60

0.70

BALL DIAMETER

eE

1.00 BSC.

BALL PITCH

eD

1.00 BSC

BALL PITCH

SD / SE

0.50 BSC.

SOLDER BALL PLACEMENT

---

DEPOPULATED SOLDER BALLS

NOTES:

1.

DIMENSIONING AND TOLERANCING METHODS PER

ASME Y14.5M-1994.

2.

ALL DIMENSIONS ARE IN MILLIMETERS.

3.

BALL POSITION DESIGNATION PER JEP95,

SECTION 4.3, SPP-010.

4.

e REPRESENTS THE SOLDER BALL GRID PITCH.

5.

SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"

DIRECTION.

SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE

"E" DIRECTION.

n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS

FOR MATRIX SIZE MD X ME.

6

DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL

DIAMETER IN A PLANE PARALLEL TO DATUM C.

7

SD AND SE ARE MEASURED WITH RESPECT TO DATUMS

A AND B AND DEFINE THE POSITION OF THE CENTER

SOLDER BALL IN THE OUTER ROW.

WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN

THE OUTER ROW SD OR SE = 0.000.

WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN

THE OUTER ROW, SD OR SE = e/2

8.

"+" INDICATES THE THEORETICAL CENTER OF

DEPOPULATED BALLS.

9

A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK

MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.