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CPC1967 Datasheet(PDF) 1 Page - Clare, Inc.

Part # CPC1967
Description  i4-PAC??Power Relay
PDF  6 Pages
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Manufacturer  CLARE [Clare, Inc.]
Direct Link  http://www.clare.com
Logo CLARE - Clare, Inc.

CPC1967 Datasheet(HTML) 1 Page - Clare, Inc.

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www.clare.com
DS-CPC1967-R03
1
CPC1967
i4-PAC™ Power Relay
e3
RoHS
2002/95/EC
Part Number
Description
CPC1967J
i4-PAC™ (25 per tube)
Parameter
Rating
Units
Blocking Voltage
400
V
P
Load Current, T
A=25°C
With 5°C/W Heat Sink
3.35
A
rms
No Heat Sink
1.35
On-resistance
0.85
Ω
RθJC
0.35
ºC/W
Applications
Features
Description
Ordering Information
Pin Configuration
• Industrial Controls
• Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense
Clare and IXYS have combined to bring OptoMOS®
technology, reliability and compact size to a new
family of high power Solid State Relays.
As part of this family, the CPC1967 single pole
normally open (1-Form-A) Solid State Power Relay is
rated for up to 3.35A
rms continuous load current with a
5°C/W heat sink.
The CPC1967 employs optically coupled MOSFET
technology to provide 2500V
rms of input to output
isolation. The output is constructed with efficient
MOSFET switches and photovoltaic die that use
Clare’s patented OptoMOS architecture while the
input, a highly efficient GaAlAs infrared LED provides
the optically coupled control. The combination of
low on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance switching applications.
The unique i4-PAC package pioneered by IXYS
allows Solid State Relays to achieve the highest load
current and power ratings. This package features
a unique IXYS process where the silicon chips are
soft soldered onto the Direct Copper Bond (DCB)
substrate instead of the traditional copper leadframe.
The DCB ceramic, the same substrate used in high
power modules, not only provides 2500V
rms isolation
but also very low thermal resistance (0.35 °C/W).
Switching Characteristics of
Normally Open (Form A) Devices
CONTROL
I
LOAD
10%
90%
TON
TOFF
+
+
Approvals
• UL recognized component: File # E69938
• Certified to: UL 508
• Compact i4-PAC Power Package
• Low Thermal Resistance (0.35 °C/W)
• 3.35A
rms Load Current with 5°C/W Heat Sink
• Electrically Non-conductive Thermal Pad for Heat
Sink Applications
• Low Drive Power Requirements
• Arc-Free With No Snubbing Circuits
• 2500V
rms Input/Output Isolation
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable


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