CPC7595 datasheet(22/25 Pages) CLARE

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CPC7595

www.clare.com

R00B

3.1.2 CPC7595B - 28 Pin SOIC Package

3.1.3 CPC7595M - 28 Pin DFN Package

NOTE: For optimum solder joint size, DFN package

printed circuit board lands should extend no more than

0.05 mm past the chip post on the short sides, and no

more than 0.025 mm past the chip posts on the long

sides.

As the metallic pad on the bottom of the DFN package

is connected to the substrate of the die, Clare

recommends that no printed circuit board traces cross

this area to avoid potential shorting issues.

17.983 MIN - 18.085 MAX

(0.708 MIN - 0.712 MAX)

7.391 MIN - 7.595 MAX

(0.291 MIN - 0.299 MAX)

10.109 MIN - 10.516 MAX

(0.398 MIN - 0.414 MAX)

1.270 TYP

(0.050 TYP)

2.438 MIN - 2.642 MAX

(0.096 MIN - 0.104 MAX)

0.366 MIN - 0.467 MAX

(0.014 MIN - 0.018 MAX)

0.660 ± 0.102

(0.026 ± 0.004)

2.235 MIN - 2.438 MAX

(0.088 MIN - 0.096 MAX)

0.508 MIN - 1.016 MAX

(0.020 MIN - 0.040 MAX)

0.2311 MIN - 0.3175 MAX

(0.0091 MIN - 0.0125 MAX)

0.254 MIN - 0.737 MAX X45º

(0.010 MIN - 0.029 MAX X45º)

DIMENSIONS

(INCHES)

PIN 28

PIN 1

0.37

(0.0146)

Pin 1

TOP VIEW

SIDE VIEW

Seating Plane

Dimensions in mm (inches)

Dimensions and tolerances conform to ANSI Y14.5M-1994

11.0

(0.4334)

7.0

(0.2758)

0.90 ± 0.10

(0.0355 ±0.0039)

0.02 +0.03/-0.02

(0.0008 +0.0012/-0.0008)

0.20

(0.0079)

Bottom side

metallic pad

0.75

(0.0295)

0.33 +0.07/

(0.0130 +0.0028/

)

-0.05

-0.0020

0.55 ± 0.10

(0.0217

0.0040)

0.60

(0.0236)

0.70

(0.0276)

0.18

(0.0071)

0.18

(0.0071)

0.61

(0.0240)

BOTTOM VIEW

5.0±0.05

(0.1970±0.0020)

7.5 ± 0.05

(0.2955 ± 0.0020)

CPC7595 Datasheet(PDF) 22 Page - Clare, Inc.

CPC7595 Datasheet(HTML) 22 Page - Clare, Inc.

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