CMOS High Voltage Logic – CD4049B

Rev 1.0

21/11/17

Features:

 

Hex Inverter / Buffer Logic IC in bare die form

 

Description

 

High Input Voltage up to 20V

Inputs allow voltages greater than VDD

 

High Source and Sink Currents

x2 TTL load drive over Military Temperature range

 

Specified at 5V, 10V & 15V

Direct drop-in replacement for obsolete

components in long term programs.  

 

 

 

 

 

 

The following part suffixes apply:

No suffix - MIL-STD-883 /2010B Visual Inspection

 

 

 

 

 

 

 

 

 

 

 

 

Die Size (Unsawn)

1550 x 1500

61 x 59

µm

mils

Minimum Bond Pad Size

106 x 106

4.17 x 4.17

µm

mils

Die Thickness

350 (±20)

13.78 (±0.79)

µm

mils

Top Metal Composition

Al 1%Si 1.1µm

Back Metal Composition

N/A – Bare Si

“H” - MIL-STD-883 /2010B Visual Inspection

+ MIL-PRF-38534 Class H LAT

“K” - MIL-STD-883 /2010A Visual Inspection (Space)

+ MIL-PRF-38534 Class K LAT

LAT = Lot Acceptance Test.

For further information on LAT process flows see below.

www.siliconsupplies.com\quality\bare-die-lot-qualification

Supply Formats:

Mechanical Specification

Default – Die in Waffle Pack (100 per tray capacity)

Sawn Wafer on Tape – On request

Unsawn Wafer – On request

Die Thickness <> 350µm(14 Mils) – On request

Assembled into Ceramic Package – On request

The CD4049B Inverting Hex Buffer is fabricated on a

3µm 15CMOS process. The device is typically used as

a Hex Buffer, CMOS to TTL converter or as a CMOS

current driver. Logic levels are converted using only

one supply voltage (VDD). Special input protection

allows the input signal high level (VIH) to exceed the

VDD supply voltage when the device is used for logic

level conversion. Two TTL/DTL loads can be driven

over the full temperature range when the devices are

used as level converters.

Ordering Information

Die Dimensions in µm (mils)

1550 (61)

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