Dual Differential Comparator – LM193

 

Low power, low offset voltage dual comparator in bare die form

Rev 1.1

21/01/18

Single-Supply range: 2-36V

Split–Supply range: ±1.0V to ±18V

Very low supply current independent of supply

voltage (1 mW/comparator at +5V)

Very Low Current Drain

Very Low Input Offset Current

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Die Size (Unsawn)

730 x 750

29 x 30

µm

mils

Minimum Bond Pad Size

90 x 90

3.54 x 3.54

µm

mils

Die Thickness

350 (±20)

13.78 (±0.79)

µm

mils

Top Metal Composition

Al 1%Si 1.1µm

Back Metal Composition

N/A – Bare Si

Low Input Offset Voltage

TTL, DTL, ECL, MOS, CMOS compatible outputs.

 

Features:

The following part suffixes apply:

Description

The LM193 is a dual precision voltage comparator

operating with either single or split supply over a wide

voltage range. In single supply operation, the device

uniquely produces a common mode range-to-ground

level. In split supply operation the low power supply

current drain is independent of the magnitude of supply

voltage and reduces power consumption versus

standard comparators. The device directly interfaces

TTL, CMOS and also interfaces MOS in split supply

configuration. Offset voltage characteristics as low as

1mV improve efficiency and further reduce power

consumption. The die size is one of the smallest in the

industry.

Ordering Information

Die Dimensions in µm (mils)

730 (29)

No suffix - MIL-STD-883 /2010B Visual Inspection

“H” - MIL-STD-883 /2010B Visual Inspection

+ MIL-PRF-38534 Class H LAT

“K” - MIL-STD-883 /2010A Visual Inspection (Space)

+ MIL-PRF-38534 Class K LAT

LAT = Lot Acceptance Test.

For further information on LAT process flows see below.

www.siliconsupplies.com\quality\bare-die-lot-qualification

For a higher electrical grade version of this product see LM193A

Supply Formats:

Mechanical Specification

Default – Die in Waffle Pack (400 per tray capacity)

Sawn Wafer on Tape – On request

Unsawn Wafer – On request

Die Thickness <> 350µm(15 Mils) – On request

Assembled into Ceramic Package – On request

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