PCA9306_2

© NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 02 — 21 February 2007

19 of 21

NXP Semiconductors

PCA9306

For further information on temperature profiles, refer to Application Note

AN10365

“Surface mount reflow soldering description”.

14. Abbreviations

15. Revision history

MSL: Moisture Sensitivity Level

Fig 16. Temperature profiles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Table 13.

Abbreviations

Acronym

Description

CDM

Charged Device Model

ESD

ElectroStatic Discharge

HBM

Human Body Model

Inter-Integrated Circuit bus

I/O

Input/Output

MM

Machine Model

PRR

Pulse Repetition Rate

SMBus

System Management Bus

Table 14.

Revision history

Document ID

Release date

Data sheet status

Change notice

Supersedes

PCA9306_2

20070221

Product data sheet

-

PCA9306_1

Modifications:

• Table 1 “Ordering information”:

– changed topside mark for type number PCA9306GM from “P06” to “P6X”

– added Table note 4

PCA9306_1

20061020

Product data sheet

-

-