SM5006 series

SEIKO NPC CORPORATION —3

PAD LAYOUT

(Unit:

µm)

PINOUT

(Top view)

PIN DESCRIPTION and PAD DIMENSIONS

BLOCK DIAGRAM

Chip size: 0.92

× 1.31mm

Chip thickness: 300 ± 30µm

Q

VDD

XT

VSS

(0,0)

(920,1310)

X

Y

INHN

XTN

1

XT

VSS

Q

VDD

4

2

3

NC

NC

8

7

6

5

XTN

INHN

Number

Name

I/O

Description

Pad dimensions [µm]

XY

1

INHN

I

Output state control input. High impedance when LOW. Pull-up resistor built in

195

212

2

XT

I

Amplifier input.

Crystal oscillator connection pins.

Crystal oscillator connected between XT and XTN

385

212

3

XTN

O

Amplifier output.

575

212

4

VSS

–

Ground

766

212

5

Q

O

765

1152

6

NC

–

No connection

–

–

7

NC

–

No connection

–

–

8

VDD

–

Supply voltage

162

1152

XT

VSS

VDD

Q

XTN

INHN