MMA7455LR2 datasheet(24/27 Pages) FREESCALE

24 / 27 page

Sensors

Freescale Semiconductor

MMA7455L

Figure 24. Stencil Design Guidelines (detailed dimensions for corner pads)

6. Do not place any components or vias at a distance less

than 2mm from the package land area. This may cause

additional package stress if it is too close to the

package land area.

7. Signal traces connected to pads should be as

symmetric as possible. Put dummy traces on NC pads

in order to have same length of exposed trace for all

pads. Signal traces with 0.1mm width and min. 0.5mm

length for all PCB land pads near the package are

recommended as shown in Figure 22, Figure 23, and

Figure 24. Wider trace can be continued after the

0.5mm zone.

8. Use a standard pick and place process and equipment.

Do not us a hand soldering process.

9. It is recommended to use a cleanable solder paste with

an additional cleaning step after SMT mount.

10. Do not use a screw down or stacking to fix the PCB into

an enclosure because this could bend the PCB putting

stress on the package.

11. The PCB should be rated for the multiple lead-free

reflow condition with max 260°C temperature.

Please cross reference with the device data sheet for

mounting guidelines specific to the exact device used.

Freescale LGA sensors are compliant with Restrictions on

Hazardous Substances (RoHS), having halide free molding

compound (green) and lead-free terminations. These

terminations are compatible with tin-lead (Sn-Pb) as well as

tin-silver-copper (Sn-Ag-Cu) solder paste soldering

processes. Reflow profiles applicable to those processes can

be used successfully for soldering the devices.

Stencil opening for 4 corner pads

= 0.625x0.875mm sq.

0.2875mm

0.3375mm

0.875mm

PCB landpad pad

= 0.6x0.9mm

Package

footprint

0.575mm

0.625mm

0.2875mm

0.875mm

0.050mm offset

Stencil opening for

normal pads =

0.575x0.875

MMA7455LR2 Datasheet(PDF) 24 Page - Freescale Semiconductor, Inc

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