4 Pin Configuration and Functions

Thermal

Pad

2

3

4

5

6

9

10

11

12

13

Not to scale

Figure 4-1. SN74ACT11-Q1 BQB Package (Transparent Top View)

PIN

I/O(1)

DESCRIPTION

NAME

NO.

1A

1

I

Channel 1, Input A

1B

2

I

Channel 1, Input B

2A

3

I

Channel 2, Input A

2B

4

I

Channel 2, Input B

2C

5

I

Channel 2, Input C

2Y

6

O

Channel 2, Output Y

GND

7

G

Ground

3Y

8

O

Channel 3, Output Y

3C

9

I

Channel 3, Input A

3B

10

I

Channel 3, Input B

3A

11

I

Channel 3, Input C

1Y

12

O

Channel 1, Output Y

1C

13

I

Channel 1, Input C

VCC

14

P

Positive Supply

Thermal pad(2)

—

The thermal pad can be connected to GND or left floating. Do not connect to any other

signal or supply

(1)

I = input, O = output, P = power, G = ground

(2)

BQA Package only

www.ti.com

SN74ACT11-Q1

SCASE76 – FEBRUARY 2025

Copyright © 2025 Texas Instruments Incorporated

Submit Document Feedback

3