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Axelite Confidential Materials, do not copy or distribute without written consent.

Rev.2.0 Oct.08, 2019

AX3101

PCB Layout Guide

If you need low Tc and Tj or large PD(Power Dissipation), The dual SW pins(5 and 6)

and VSS pins(7 and 8)on the SOP-8L package are internally connected to die pad, The PCB

layout should allow for maximum possible copper area at the SW pins.

1. Connect C3 to VCC and VSS pin as closely as possible to get good power filter effect.

2. Connect R3 to VCC and OCSET pin as closely as possible.

3. Connect ground side of the C2 and D1 as closely as possible.

The heat sink copper of PCB area

should be solder-painted without

masked.

Use through hole to conduct the

heat into the backside of PCB

layer.

Bypass C3 need closely from

IC

’s Vcc to Vss pins.