8.2 Documentation Support

8.2.1 Related Documentation

The following documents are recommended as a reference for this device, and available for download at

www.ti.com:

• Texas Instruments, Software Pacemaker Detection design guide

• Texas Instruments, TIDA-00378 Schematic and Block Diagram

• Texas Instruments, PM2.5/PM10 Particle Sensor Analog Front-End for Air Quality Monitoring Design design

guide

• Texas Instruments, QFN/SON PCB Attachment application note

• Texas Instruments, Quad Flatpack No-Lead Logic Packages application note

• Texas Instruments, Compensate Transimpedance Amplifiers Intuitively application note

• Texas Instruments, Noise Analysis of FET Transimpedance Amplifiers application note

• Texas Instruments, Noise Analysis for High-Speed Op Amps application note

8.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

8.4 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

8.5 Trademarks

e

‑trim™, TINA-TI™, and TI E2E™ are trademarks of Texas Instruments.

TINA™ is a trademark of DesignSoft, Inc.

PSpice® is a registered trademark of Cadence Design Systems, Inc.

All trademarks are the property of their respective owners.

8.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

8.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

9 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision D (December 2023) to Revision E (January 2025)

Page

• Added OPA2328 YBJ package to Device Information .......................................................................................1

• Added OPA2328 YBJ (WCSP, 24) pin configuration and pin functions table..................................................... 3

• Added YBJ (DSBGA) package to Thermal Information - OPA2328 .................................................................. 7

OPA328, OPA2328

SBOS957E – FEBRUARY 2022 – REVISED JANUARY 2025

www.ti.com

24

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Product Folder Links: OPA328 OPA2328