LR645

DS20005384B-page 17

 2015-2023 Microchip Technology Inc. and its subsidiaries

Microchip Technology Drawing C04-101-TO Rev D Sheet 2 of 2

3-Lead Plastic Transistor Outline (TO) [TO-92]

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

2. Dimensioning and tolerancing per ASME Y14.5M

1. Dimensions D and E do not include mold flash or protrusions. Mold flash or

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

protrusions shall not exceed .005" per side.

Notes:

.022

.014

b

Lead Width

.021

.014

c

Lead Thickness

.105

.080

R

Molded Package Radius

.210

.170

A

Overall Length

.205

.175

E

Overall Width

.165

.125

D

Bottom to Package Flat

.050 BSC

e

Pitch

3

N

Number of Pins

MAX

MIN

Dimension Limits

INCHES

Units

Tip to Seating Plane

L

.500

-

NOM

-

-

-

-

-

-

-