Pad Coordinates

Chip size: 160

× 159 (mil)2

* The IC substrate should be connected to VDD in the PCB layout artwork.

Unit: mil

Pad No.

X

Y

Pad No.

X

Y

Pad No.

X

Y

1

–73.80

73.22

21

–33.57

–73.22

41

73.80

13.50

2

–73.80

62.10

22

–21.42

–73.22

42

73.80

21.60

3

–73.80

54.00

23

–10.94

–73.22

43

73.80

29.70

4

–73.80

45.90

24

0.81

–73.22

44

73.80

37.80

5

–73.80

37.80

25

8.19

–73.22

45

73.80

45.90

6

–73.80

29.70

26

18.09

–73.22

46

73.80

54.00

7

–73.80

21.60

27

27.99

–73.22

47

73.80

62.10

8

–73.80

13.50

28

37.89

–73.22

48

73.80

73.22

9

–73.80

5.40

29

47.79

–73.22

49

61.60

73.22

10

–73.80

–2.70

30

57.69

–73.22

50

51.35

73.22

11

–73.80

–10.80

31

73.80

–73.22

51

41.99

73.22

12

–73.80

–18.90

32

73.80

–59.40

52

30.06

73.22

13

–73.80

–27.00

33

73.80

–51.30

53

21.78

73.22

14

–73.80

–35.10

34

73.80

–43.20

54

13.68

73.22

15

–73.80

–43.20

35

73.80

–35.10

55

5.58

73.22

16

–73.80

–51.30

36

73.80

–27.00

56

–24.30

73.22

17

–73.80

–59.40

37

73.80

–18.90

57

–32.40

73.22

18

–73.80

–73.22

38

73.80

–10.80

58

–40.50

73.22

19

–51.03

–73.22

39

73.80

–2.90

59

–52.74

73.22

20

–42.03

–73.22

40

73.80

5.40

HT1608

3

3rd Feb ’98