CRF02

2006-11-07

2

Characteristics

Symbol

Test Condition

Min

Typ.

Max

Unit

Peak forward voltage

⎯

2.2

3.0

V

Repetitive peak reverse current

⎯

⎯

3.0

μA

Repetitive peak reverse current

⎯

⎯

50

μA

Reverse recovery time

⎯

⎯

100

ns

Device mounted on a ceramic board

(board size: 50 mm

× 50 mm)

(soldering land: 2 mm

× 2 mm)

(board thickness: 0.64 t)

⎯

⎯

70

Device mounted on a glass-epoxy board

(board size: 50 mm

× 50 mm)

(soldering land: 6 mm

× 6 mm)

(board thickness: 1.6 t)

⎯

⎯

140

Thermal resistance

Device mounted on a glass-epoxy board

(board size: 50 mm

× 50 mm)

(soldering land: 1.2 mm

× 1.2 mm)

(board thickness: 1.6 t)

⎯

⎯

240

°C/W

Thermal resistance (junction to lead)

⎯

⎯

⎯

20

°C/W

Marking

Standard Soldering Pad

Abbreviation Code

Part No.

F2

CRF02

Handling Precaution

The absolute maximum ratings mean the absolute maximum ratings, which are rated values and must not be exceeded

during operation, even for an instant. The followings are the general derating method that we recommend for designing a

circuit using this device.

VRRM: We recommend that the worst-case voltage, including surge voltage, be no greater than 80% of the absolute

maximum rating of VRRM for a DC circuit; and no greater than 50% of that of VRRM for an AC circuit.

VRRM has a temperature coefficient (0.1%/℃). Be sure to take this temperature coefficient into account when

designing a device at low temperature.

IF(AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of IF(AV).

Carry out sufficient heat design. If it is not possible to design a circuit with excellent heat radiation, set a margin by

using an allowable Tamax-IF (AV) curve.

This rating specifies the non-repetitive peak current in one cycle of a 50-Hz sine wave, condition angle 180

°. Therefore

this applies only to abnormal operation, which seldom occurs during the lifespan of the device.

For this device, we recommend a Tj of below 120℃ under the worst load and heat radiation conditions.

Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the device. When

using the device, be sure to design the circuit board and soldering land size to match the appropriate thermal resistance

value.

Refer to the Rectifier databook for further information.

2.8

1.2

1.2

Unit: mm