8.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

9 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision U (January 2015) to Revision V (September 2024)

Page

• Updated the numbering format for tables, figures, and cross-references throughout the document................. 1

• Added M3 devices to document and added the M3 new silicon Thermal Information table.............................. 1

• Changed max output current.............................................................................................................................. 4

• Changed VFB typical value................................................................................................................................. 6

• Added M3 new silicon current limit.....................................................................................................................6

• Added new silicon plots to Typical Characteristics section.................................................................................7

• Changed Output current value from 500 mA to 400 mA in Design Parameters (Fixed-Voltage Version) table20

• Changed Detailed Design Procedure section: Changed dropout voltage value from 0.5 A to 0.4 A, changed

maximum dropout voltage from an estimation to 200 mV ............................................................................... 20

• Added new silicon plots to Application Curves section.....................................................................................23

• Added Layout Example for the DBV Package Adjustable Version through Layout Example for the DCQ

Package Fixed Version figures to Layout Examples section............................................................................25

• Added M3 information to Device Nomenclature section...................................................................................28

Changes from Revision T (August 2010) to Revision U (January 2015)

Page

• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and

Implementation section, Power Supply Recommendations section, Layout section, Device and

Documentation Support section, and Mechanical, Packaging, and Orderable Information section .................. 1

10 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

www.ti.com

TPS736

SBVS038V – SEPTEMBER 2003 – REVISED SEPTEMBER 2024

Copyright © 2024 Texas Instruments Incorporated

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