TLP1243(C8)

2007-10-01

3

Recommended Connector

Mini CT connector (1.5-mm pitch, receptacle assembly/housing crimp type) made by

Tyco Electronics AMP, Ltd.

Type

Model Number

Terminal Material

AWG Size

External Diameter of

Insulation Coating

Receptacle

assembly

353293-3

Housing-Terminal

En Block Type

Housing crimp type

353908-3

Phosphor bronze

AWG26 to 28

0.85 mm to 0.95 mm

Note:

For further details of connector characteristics, please contact the relevant connector manufacturer.

Precautions

• Protect the device from ambient light interference. The integrated phototransistor is insensitive to light below

700 nm (e.g., fluorescent light), but is sensitive to light above 700 nm (e.g., incandescent light). If it detects

ambient light, it may cause malfunction. Be sure to make a thorough evaluation of the equipment in which the

device is to be used.

• Care must be taken regarding the environment in which the device is to be installed. Oil or chemicals may

cause the package to melt or crack.

• When attaching the device to the metal board, always hold the body of the device. Do not hold the device by the

connector. Ensure that the board is flat, and not warped or twisted. Attach the device to the metal board at

room temperature.

• Toshiba recommends attaching the device to the smoother side of the board.

• Toshiba recommends testing the attachment strength beforehand by actually attaching a device to the board.

• Do not apply solder to the pins of the device's connector. Make sure that the connector is plugged into the Mini

CT connector or equivalent connector.

• When inserting or removing the Mini CT connector or equivalent connector, always grasp it and its cable firmly

and either plug it straight into or pull it straight out of the device's connector. If the Mini CT connector or

equivalent connector is inserted or removed at an angle, both the device's connector and the Mini CT connector

or equivalent connector may get damaged, resulting in an unreliable connection.

• Conversion efficiency decreases over time due to current flow in the infrared LED. When designing a circuit,

take into account this change in conversion efficiency over time. The ratio of fluctuation in conversion efficiency

to fluctuation in infrared LED optical output is 1:1:

• The leadframe of the package is exposed as shown below. Ensure that no conductive material or object (such as

a metal pin) comes into contact with the leads of the leadframe and shorts them together. Care must be taken

when designing a chassis.

=

Top View

(1)

(2)

(3)

(4)

(5)

Connector

Leads (1) to (5) of the leadframe shown

on the left must not be shorted together.

.