74HC_HCT11_3

© NXP B.V. 2010. All rights reserved.

Product data sheet

Rev. 03 — 9 February 2010

8 of 15

NXP Semiconductors

74HC11; 74HCT11

Triple 3-input AND gate

12. Package outline

Fig 8.

Package outline SOT27-1 (DIP14)

UNIT

A

max.

1

2

(1)

(1)

b1

cD

(1)

Z

Ee

MH

L

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

inches

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT27-1

99-12-27

03-02-13

A

min.

A

max.

b

max.

w

M E

e 1

1.73

1.13

0.53

0.38

0.36

0.23

19.50

18.55

6.48

6.20

3.60

3.05

0.254

2.54

7.62

8.25

7.80

10.0

8.3

2.2

4.2

0.51

3.2

0.068

0.044

0.021

0.015

0.77

0.73

0.014

0.009

0.26

0.24

0.14

0.12

0.01

0.1

0.3

0.32

0.31

0.39

0.33

0.087

0.17

0.02

0.13

050G04

MO-001

SC-501-14

MH

c

(e )

1

ME

A

L

A1

w M

b1

e

D

A2

Z

14

1

8

7

b

E

pin 1 index

0

5

10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

DIP14: plastic dual in-line package; 14 leads (300 mil)

SOT27-1