74HC_HCT11_3

© NXP B.V. 2010. All rights reserved.

Product data sheet

Rev. 03 — 9 February 2010

11 of 15

NXP Semiconductors

74HC11; 74HCT11

Triple 3-input AND gate

Fig 11. Package outline SOT402-1 (TSSOP14)

UNIT

A1

A2

A3

bp

cD (1)

E (2)

(1)

eHE

LLp

QZ

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

5.1

4.9

4.5

4.3

0.65

6.6

6.2

0.4

0.3

0.72

0.38

8

0

o

o

0.13

0.1

0.2

1

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT402-1

MO-153

99-12-27

03-02-18

w M

b p

D

Z

e

0.25

17

14

8

θ

A

A1

A2

L p

Q

detail X

L

(A )

3

HE

E

c

v M A

X

A

y

0

2.5

5 mm

scale

TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm

SOT402-1

A

max.

1.1

pin 1 index