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MAX40658E/D Datasheet(PDF) 2 Page - Analog Devices |
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MAX40658E/D Datasheet(HTML) 2 Page - Analog Devices |
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2 / 12 page ![]() Supply Voltage .....................................................-0.5V to +4.2V Current Into IN................................................................+100mA Voltage at OUT+, OUT-......................VCC - 1.2V to VCC + 0.5V Voltage at CCAP ....................................................-0.3V to 1.2V Continuous Power Dissipation (TA = +85°C, derate 24.4mW/°C above +85°C.)..........................1904.8mW Operating Temperature Range........................... -40°C to +85°C Operating Junction Temperature Range (die).. -40°C to +150°C Storage Temperature Range............................ -55°C to +150°C Soldering Temperature (reflow).......................................+260°C Die Attach Temperature...................................................+400°C ESD HBM Rating at IN......................................................±150V The MAX40658/MAX40659 amplifiers can be damaged by electrostatic discharge (ESD). They must be handled with appropriate precautions. Failure to observe proper handling can cause damage. ESD damage can range from small performance shifts to product failure. CAUTION! ESD SENSITIVE DEVICE Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 8-TDFN PACKAGE CODE T833+1F Outline Number 21-0137 Land Pattern Number 90-100071 Thermal Resistance, Single-Layer Board: Junction to Ambient (θJA) 55°C/W Junction to Case (θJC) 8°C/W Thermal Resistance, Four-Layer Board: Junction to Ambient (θJA) 42°C/W Junction to Case (θJC) 8°C/W Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package Information www.analog.com Analog Devices │ 2 MAX40658/MAX40659 Transimpedance Amplifier with 100mA Input Current Clamp for LiDAR Applications |
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