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USB3290 Datasheet(PDF) 15 Page - SMSC Corporation |
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USB3290 Datasheet(HTML) 15 Page - SMSC Corporation |
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15 / 46 page ![]() Small Footprint Hi-Speed USB 2.0 Device PHY with UTMI Interface Datasheet SMSC USB3290 15 Revision 1.5 (11-02-07) DATASHEET Note 6.3 VDD3.3 = 3.0 to 3.6V; VSS = 0V; TA = -40 oC to 85oC; unless otherwise specified. Note 6.4 VDD3.3 = 3.0 to 3.6V; VSS = 0V; TA = -40 oC to 85oC; unless otherwise specified. High Speed High Level Output Voltage (DP/DM referenced to GND) VHSOH 45 Ω load 360 440 mV High Speed IDLE Level Output Voltage (DP/DM referenced to GND) VOLHS 45 Ω load -10 10 mV Chirp-J Output Voltage (Differential) VCHIRPJ HS termination resistor disabled, pull-up resistor connected. 45 Ω load. 700 1100 mV Chirp-K Output Voltage (Differential) VCHIRPK HS termination resistor disabled, pull-up resistor connected. 45 Ω load. -900 -500 mV Leakage Current OFF-State Leakage Current ILZ ± 1 uA Port Capacitance Transceiver Input Capacitance CIN Pin to GND 5 10 pF Table 6.4 Dynamic Characteristics: Analog I/O Pins (DP/DM) ( Note 6.4) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS FS Output Driver Timing Rise Time TFSR CL = 50pF; 10 to 90% of |VOH - VOL| 420 ns Fall Time TFFF CL = 50pF; 10 to 90% of |VOH - VOL| 420 ns Output Signal Crossover Voltage VCRS Excluding the first transition from IDLE state 1.3 2.0 V Differential Rise/Fall Time Matching FRFM Excluding the first transition from IDLE state 90 111.1 % HS Output Driver Timing Differential Rise Time THSR 500 ps Differential Fall Time THSF 500 ps Driver Waveform Requirements Eye pattern of Template 1 in USB 2.0 specification See Figure 6.2 High Speed Mode Timing Receiver Waveform Requirements Eye pattern of Template 4 in USB 2.0 specification See Figure 6.2 Data Source Jitter and Receiver Jitter Tolerance Eye pattern of Template 4 in USB 2.0 specification See Figure 6.2 Table 6.3 DC Electrical Characteristics: Analog I/O Pins (DP/DM) ( Note 6.3) (continued) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS |
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