BAV23SH

Taiwan Semiconductor

2

Version: A2501

THERMAL PERFORMANCE

PARAMETER

SYMBOL

TYP

UNIT

Junction-to-ambient thermal resistance(1)

RӨJA

357

°C/W

Thermal Performance Note:

1.

Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint

ELECTRICAL SPECIFICATIONS (T

A

= 25°C unless otherwise noted)

PARAMETER

CONDITIONS

SYMBOL

MIN

TYP

MAX

UNIT

Forward voltage(1)

IF = 100mA

VF

-

-

1.00

V

IF = 200mA

-

-

1.25

Reverse breakdown voltage

IR

= 100μA

VBR

250

-

-

V

Reverse current(2)

VR = 200V

IR

-

-

0.1

μA

VR = 200V, TJ = 150°C

-

-

100

μA

Junction capacitance

f = 1MHz, VR = 0V

CJ

-

-

5

pF

Reverse recovery time

IF = IR = 30mA,

IRR = 3mA, RL =

100Ω

trr

-

-

50

ns

Notes:

1.

Pulse test with PW=0.3 ms

2.

Pulse test with PW=30 ms

ORDERING INFORMATION

ORDERING CODE

PACKAGE

PACKING

BAV23SH RFG

SOT-23

3,000 / 7” Tape & Reel